US D471167 S1
FIG. 1 is a perspective view of a hybrid integrated circuit board showing an embodiment of our new design;
FIG. 2 is a front elevational view thereof, which is symmetrical to a rear elevational view not shown herein;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.