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Publication numberUSD471167 S1
Publication typeGrant
Application numberUS 29/158,467
Publication dateMar 4, 2003
Filing dateApr 5, 2002
Priority dateApr 27, 2001
Also published asUSD466093
Publication number158467, 29158467, US D471167 S1, US D471167S1, US-S1-D471167, USD471167 S1, USD471167S1
InventorsHitoshi Ebihara, Naoki Tomaru, Yoshiyuki Wasada, Tetsuya Ito, Hideki Kato, Tomohiro Igarashi, Hideki Yoda
Original AssigneeTaiyo Yuden Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Hybrid integrated circuit board
US D471167 S1
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  1. The ornamental design for a hybrid integrated circuit board, as shown and described.

FIG. 1 is a perspective view of a hybrid integrated circuit board showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof, which is symmetrical to a rear elevational view not shown herein;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

U.S. ClassificationD13/182