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Publication numberUSD471168 S1
Publication typeGrant
Application numberUS 29/152,997
Publication dateMar 4, 2003
Filing dateJan 7, 2002
Priority dateJan 7, 2002
Publication number152997, 29152997, US D471168 S1, US D471168S1, US-S1-D471168, USD471168 S1, USD471168S1
InventorsDavid Ge, Mohammed Nusrat Jamal
Original AssigneeTeletronics International
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipating RF electronics housing
US D471168 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for a heat dissipating RF electronics housing, as shown and described.
Description

FIG. 1 is a perspective photographic view from a first side of the electronics housing according to the invention.

FIG. 2 is a perspective photographic view from the opposite side of the housing according to FIG. 1.

FIG. 3 is a top photographic view of the housing according to FIG. 1.

FIG. 4 is a side photographic view of the housing according to FIG. 1.

FIG. 5 is a perspective photographic view from an end of the housing according to FIG. 1.

FIG. 6 is an end view of the housing according to FIG. 5; and,

FIG. 7 is a photographic view of the bottom of the housing according to FIG. 1.

Non-Patent Citations
Reference
1HyperLink Technologies, Inc., "HyperAmp™ HA2401A," Jan. 20, 2001, Web Article: www.hyperlinktech.com/html/products/ha2401a.html.
2Young Design, Inc., "AMP 2440," Jan. 20, 2001, Web Article: www.ydi.com/Products/Amplifiers/AMP2440/amp2440.html.
Classifications
U.S. ClassificationD13/184