Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD472528 S1
Publication typeGrant
Application numberUS 29/151,069
Publication dateApr 1, 2003
Filing dateOct 31, 2001
Priority dateOct 31, 2001
Publication number151069, 29151069, US D472528 S1, US D472528S1, US-S1-D472528, USD472528 S1, USD472528S1
InventorsYehja Mohammed Kasem, Frank Kuo, Eddy Tjhia
Original AssigneeSiliconix Incorporated
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor chip package
US D472528 S1
Abstract  available in
Images(9)
Previous page
Next page
Claims(1)
  1. The ornamental design for a semiconductor chip package, as shown and described.
Description

FIG. 1 is a perspective view from the left side and above the semiconductor chip package;

FIG. 2 is a perspective view from the left side and below the semiconductor chip package;

FIG. 3 is an elevational view from the left side of the semiconductor chip package;

FIG. 4 is an elevational view from the right side of the semiconductor chip package;

FIG. 5 is an elevational view from the back side of the semiconductor chip package;

FIG. 6 is an elevational view from the front side of the semiconductor chip package;

FIG. 7 is a top view of the semiconductor chip package; and,

FIG. 8 is a bottom view of the semiconductor chip package.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7166496Sep 9, 2005Jan 23, 2007Ciclon Semiconductor Device Corp.Method of making a packaged semiconductor device
US7446375Mar 14, 2006Nov 4, 2008Ciclon Semiconductor Device Corp.Quasi-vertical LDMOS device having closed cell layout
US7504733Aug 17, 2005Mar 17, 2009Ciclon Semiconductor Device Corp.Semiconductor die package
US7560808Oct 19, 2005Jul 14, 2009Texas Instruments IncorporatedChip scale power LDMOS device
US7608919Nov 15, 2006Oct 27, 2009University Of Notre Dame Du LacInterconnect packaging systems
US7612443Sep 3, 2004Nov 3, 2009University Of Notre Dame Du LacInter-chip communication
US8021965Nov 15, 2006Sep 20, 2011University Of Norte Dame Du LacInter-chip communication
US8049312Jan 12, 2009Nov 1, 2011Texas Instruments IncorporatedSemiconductor device package and method of assembly thereof
US8304903Dec 13, 2010Nov 6, 2012Texas Instruments IncorporatedWirebond-less semiconductor package
US8623700Nov 15, 2006Jan 7, 2014University Of Notre Dame Du LacInter-chip communication
Classifications
U.S. ClassificationD13/182