|Publication number||USD472880 S1|
|Application number||US 29/145,446|
|Publication date||Apr 8, 2003|
|Filing date||Jul 23, 2001|
|Priority date||Jul 23, 2001|
|Publication number||145446, 29145446, US D472880 S1, US D472880S1, US-S1-D472880, USD472880 S1, USD472880S1|
|Inventors||Bradley E Clements, Joseph M White|
|Original Assignee||Hewlett-Packard Company|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (2), Classifications (1)|
|External Links: USPTO, USPTO Assignment, Espacenet|
FIG. 1 is an oblique view of an electrical contact showing the new design.
FIG. 2 is a top view of the electrical contact of FIG. 1.
FIG. 3 is an oblique view of an alternate embodiment of the electrical contact of FIG. 1; and,
FIG. 4 is a top view of the electrical contact of FIG. 3.
The broken line showing the through-plated hole and surrounding metal in FIGS. 1 through 4 is for illustrative purposes only and forms no part of the claimed design.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7752738||Jul 13, 2010||Palo Alto Research Center Incorporated||Methods for fabricating thin complaint spring contacts|
|US20090208830 *||May 26, 2006||Aug 20, 2009||Gs Yuasa Corporation||Lead for sealed battery, sealed battery using the same and method of manufacturing the same|