US D474741 S1
Abstract available in
This patent application is related to a patent application of the same applicant entitled “Electrical Interconnect having an Integral Resilient Portion” simultaneously filed and copending with this application.
FIG. 1 is a top front perspective view of an electrical interconnect having an integral helically shaped resilient portion showing my new design.
FIG. 2 is a side elevational view thereof.
FIG. 3 is a top elevational view thereof; and,
FIG. 4 is a bottom elevational view thereof.