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Publication numberUSD474754 S1
Publication typeGrant
Application numberUS 29/164,422
Publication dateMay 20, 2003
Filing dateJul 25, 2002
Priority dateJul 15, 2002
Publication number164422, 29164422, US D474754 S1, US D474754S1, US-S1-D474754, USD474754 S1, USD474754S1
InventorsLi-Kuang Tan, Yu-Hung Huang, Kuo-Cheng Lin, Wen-Shi Huang
Original AssigneeDelta Electronics Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink
US D474754 S1
Images(6)
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Claims(1)
  1. The ornamental design for a heat sink, as shown and described herein.
Description

FIG. 1 is a perspective view of a heat sink showing our new design;

FIG. 2 is a right side view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a rear view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8297341 *Sep 8, 2008Oct 30, 2012Getac Technology Corp.Heat dissipating structure and method of forming the same
US20100059213 *Sep 8, 2008Mar 11, 2010Mitac Techonology Corp.Heat dissipating structure and method of forming the same
Classifications
U.S. ClassificationD13/179