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Publication numberUSD476958 S1
Publication typeGrant
Application numberUS 29/159,822
Publication dateJul 8, 2003
Filing dateApr 30, 2002
Priority dateApr 30, 2002
Publication number159822, 29159822, US D476958 S1, US D476958S1, US-S1-D476958, USD476958 S1, USD476958S1
InventorsBor-bin Tsai
Original AssigneeAsia Vital Components Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Radiator
US D476958 S1
Abstract  available in
Images(3)
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Claims(1)
  1. The ornamental design for a radiator, as shown and described.
Description

FIG. 1 is a front elevational view of a radiator showing my design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6714415 *Mar 13, 2003Mar 30, 2004Intel CorporationSplit fin heat sink
US7423877 *Sep 1, 2006Sep 9, 2008Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US8593814 *Jul 12, 2011Nov 26, 2013Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat sink assembly
US20080055854 *Sep 1, 2006Mar 6, 2008Foxconn Technology Co., Ltd.Heat dissipation device
US20090073656 *Dec 20, 2007Mar 19, 2009Nidec CorporationHeat sink, heat sink fan, and method for manufacturing the same
US20120188722 *Jul 12, 2011Jul 26, 2012Hon Hai Precision Industry Co., Ltd.Heat sink assembly
Classifications
U.S. ClassificationD13/179