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Publication numberUSD478875 S1
Publication typeGrant
Application numberUS 29/159,786
Publication dateAug 26, 2003
Filing dateApr 30, 2002
Priority dateNov 5, 2001
Publication number159786, 29159786, US D478875 S1, US D478875S1, US-S1-D478875, USD478875 S1, USD478875S1
InventorsSang-Cheol Lee
Original AssigneeZalman Tech Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Duct and housing unit for a heat sink for electronic equipment
US D478875 S1
Abstract  available in
Images(6)
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Claims(1)
  1. I claim the ornamental design for a duct and housing unit for a heat sink for electronic equipment, as shown and described.
Description

FIG. 1 is a perspective view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.

FIG. 2 is a front view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.

FIG. 3 is a rear view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.

FIG. 4 is a right side view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.

FIG. 5 is a left side view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.

FIG. 6 is a top plan view of a duct and housing unit for a heat sink for electronic equipment according to the present invention.

FIG. 7 is a bottom plan view of a duct and housing unit for a heat sink for electronic equipment according to the present invention; and,

FIG. 8 is an exploded perspective view for illustrating the use of the radiator.

The broken line showing of a radiator and fan housing is for illustrative purposes only and forms no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7532472 *Nov 28, 2006May 12, 2009Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device
US7583503 *Mar 10, 2008Sep 1, 2009Asia Vital Components Co., Ltd.Thermal module allowing adjustment in the height of heat sink relative to fixing rack
US20070242433 *Nov 28, 2006Oct 18, 2007Hon Hai Precision Industry Co., Ltd.Heat dissipation device
US20090129023 *Mar 10, 2008May 21, 2009Kuo-Sheng LinThermal module allowing adjustment in the height of heat sink relative to fixing rack
Classifications
U.S. ClassificationD13/179