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Publication numberUSD481684 S1
Publication typeGrant
Application numberUS 29/161,079
Publication dateNov 4, 2003
Filing dateMay 22, 2002
Priority dateMay 22, 2002
Also published asUSD496910, USD499383
Publication number161079, 29161079, US D481684 S1, US D481684S1, US-S1-D481684, USD481684 S1, USD481684S1
InventorsRichard Bomar
Original AssigneeThomas & Betts International, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Bonding tab
US D481684 S1
Images(5)
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Claims(1)
  1. The ornamental design for a bonding tab, as shown and described.
Description

FIG. 1 is a perspective view of the preferred bonding tab design.

FIG. 2 is a top plan view of the preferred bonding tab design.

FIG. 3 is a side elevation view of the preferred bonding tab design.

FIG. 4 is a bottom plan view of the preferred bonding tab design.

FIG. 5 is a raised side elevation view of the preferred bonding tab design.

FIG. 6 is a first end side elevation view of the preferred bonding tab design.

FIG. 7 is a second end side elevation view of the preferred bonding tab design.

FIG. 8 is a perspective view of the rectangular embodiment of the bonding tab design.

FIG. 9 is a top plan view of the rectangular embodiment of the bonding tab design.

FIG. 10 is a side elevation view of the rectangular embodiment of the bonding tab design.

FIG. 11 is a bottom plan view of the rectangular embodiment of the bonding tab design.

FIG. 12 is a raised side elevation view of the rectangular embodiment of the bonding tab design.

FIG. 13 is a first end side elevation view of the rectangular embodiment of the bonding tab design; and,

FIG. 14 is a second end side elevation view of the rectangular embodiment of the bonding tab design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8174351May 16, 2008May 8, 2012Group Dekko, Inc.Thermal assembly coupled with an appliance
Classifications
U.S. ClassificationD13/154