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Publication numberUSD483469 S1
Publication typeGrant
Application numberUS 29/171,548
Publication dateDec 9, 2003
Filing dateNov 25, 2002
Priority dateSep 13, 2002
Publication number171548, 29171548, US D483469 S1, US D483469S1, US-S1-D483469, USD483469 S1, USD483469S1
InventorsChih-Hao Hsia, Kuo-Cheng Lin, Wen-Shi Huang
Original AssigneeDelta Electronics Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Clip for securing a heat-dissipating module
US D483469 S1
Abstract  available in
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  1. The ornamental design for clip for securing a heat-dissipating module, as shown and described herein.

FIG. 1 is a perspective view of clip for securing a heat-dissipating module showing our new design;

FIG. 2 is a right side view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a rear view thereof.

U.S. ClassificationD23/411