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Publication numberUSD484859 S1
Publication typeGrant
Application numberUS 29/175,608
Publication dateJan 6, 2004
Filing dateFeb 7, 2003
Priority dateFeb 7, 2003
Publication number175608, 29175608, US D484859 S1, US D484859S1, US-S1-D484859, USD484859 S1, USD484859S1
InventorsJames Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Portion of a matrix for surface mount package leadframe
US D484859 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe showing my new design.

Classifications
U.S. ClassificationD13/182