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Publication numberUSD487885 S1
Publication typeGrant
Application numberUS 29/180,906
Publication dateMar 30, 2004
Filing dateMay 2, 2003
Priority dateMar 14, 2003
Publication number180906, 29180906, US D487885 S1, US D487885S1, US-S1-D487885, USD487885 S1, USD487885S1
InventorsWei-Feng Fan
Original AssigneeDatech Technology Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat pipe heat sink assembly
US D487885 S1
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for a heat pipe heat sink assembly, as shown and described.
Description

FIG. 1 is a perspective view of a heat pipe heat sink assembly, in accordance with the present invention;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7643293 *Dec 18, 2007Jan 5, 2010Hon Hai Precision Industry Co., Ltd.Heat dissipation device and a method for manufacturing the same
Classifications
U.S. ClassificationD13/179