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Publication numberUSD488136 S1
Publication typeGrant
Application numberUS 29/173,646
Publication dateApr 6, 2004
Filing dateJan 3, 2003
Priority dateJan 3, 2003
Publication number173646, 29173646, US D488136 S1, US D488136S1, US-S1-D488136, USD488136 S1, USD488136S1
InventorsJames Harnden, Richard K. Williams, Anthony Chia, Chu Weibing, Allen K. Lam
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Portion of a matrix for surface mount package leadframe
US D488136 S1
Images(4)
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Claims(1)
  1. The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.

Classifications
U.S. ClassificationD13/182