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Publication numberUSD489338 S1
Publication typeGrant
Application numberUS 29/187,122
Publication dateMay 4, 2004
Filing dateJul 28, 2003
Priority dateJul 28, 2003
Publication number187122, 29187122, US D489338 S1, US D489338S1, US-S1-D489338, USD489338 S1, USD489338S1
InventorsMichael Seddon, Francis Carney, Kent L. Kime
Original AssigneeSemiconductor Components Industries, L.L.C.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Packaged semiconductor device
US D489338 S1
Abstract  available in
Images(10)
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Claims(1)
  1. We claim the ornamental design for a packaged semiconductor device, as shown and described.
Description

FIG. 1 is a perspective view from the back right side and above the packaged semiconductor device;

FIG. 2 is a perspective view from the front left side and above the packaged semiconductor device;

FIG. 3 is a perspective view from the front left side and below the packaged semiconductor device;

FIG. 4 is a top view of the packaged semiconductor device;

FIG. 5 is a bottom view of the packaged semiconductor device;

FIG. 6 is an elevational view from the left side of the packaged semiconductor device;

FIG. 7 is an elevational view from the right side of the packaged semiconductor device;

FIG. 8 is an elevational view from the back side of the packaged semiconductor device; and,

FIG. 9 is an elevational view from the front side of the packaged semiconductor device.

Classifications
U.S. ClassificationD13/182