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Publication numberUSD492267 S1
Publication typeGrant
Application numberUS 29/190,733
Publication dateJun 29, 2004
Filing dateSep 25, 2003
Priority dateMar 26, 2003
Publication number190733, 29190733, US D492267 S1, US D492267S1, US-S1-D492267, USD492267 S1, USD492267S1
InventorsKeiji Kawajiri, Tomohisa Okimoto, Eiichi Koga
Original AssigneeMatsushita Electric Industrial Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Composite electronic component
US D492267 S1
Abstract  available in
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  1. The ornamental design for a composite electronic component, as shown and described.

FIG. 1 is a perspective view of the front, bottom and left side of a composite electronic component showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7608919Nov 15, 2006Oct 27, 2009University Of Notre Dame Du LacInterconnect packaging systems
US7612443Sep 3, 2004Nov 3, 2009University Of Notre Dame Du LacInter-chip communication
US8021965Nov 15, 2006Sep 20, 2011University Of Norte Dame Du LacInter-chip communication
US8623700Nov 15, 2006Jan 7, 2014University Of Notre Dame Du LacInter-chip communication
U.S. ClassificationD13/184