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Publication numberUSD493873 S1
Publication typeGrant
Application numberUS 29/171,429
Publication dateAug 3, 2004
Filing dateNov 21, 2002
Priority dateMay 24, 2002
Publication number171429, 29171429, US D493873 S1, US D493873S1, US-S1-D493873, USD493873 S1, USD493873S1
InventorsDaisuke Hayashi
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heating gas supplier for semiconductor manufacturing equipment
US D493873 S1
Abstract  available in
Images(4)
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Claims(1)
  1. I claim the ornamental design for heating gas supplier for semiconductor manufacturing equipment, as shown and described.
Description

This article is transparent. This article is used in semiconductor manufacturing equipment. A heating gas is supplied to the rear face of a semiconductor wafer in order to drive heat exchange between a lower electrode and the rear face of the semiconductor wafer. This article is installed in a tube for supplying the heating gas. In the front view drawing, the spiral forms three two-cavity ducts. The spiral ducts act as gas passages in order to prevent an abnormal discharge. The outer diameter of this article is between about 25 mm and 10 mm and the height is between about 60 mm and 70 mm. This article is made of quartz. Other embodiments (not shown) are translucent or opaque in whole or part and/or may be made of other materials.

FIG. 1 is a top/front perspective view of a first embodiment of a heating gas supplier for semiconductor manufacturing equipment;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a sectional view taken along the line 88 in FIG. 6;

FIG. 9 is a top/front perspective view of a second embodiment of the heating gas supplier for semiconductor manufacturing equipment;

FIG. 10 is a front elevational view thereof, the rear elevational view being a mirror image thereof and, therefore, not shown;

FIG. 11 is a right side elevational view thereof, the left side elevational view being a mirror image thereof and, therefore, not shown;

FIG. 12 is a top plan view thereof;

FIG. 13 is a bottom plan view thereof; and,

FIG. 14 is a sectional view taken along the line 1414 in FIG. 12.

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Classifications
U.S. ClassificationD23/314