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Publication numberUSD500745 S1
Publication typeGrant
Application numberUS 29/206,002
Publication dateJan 11, 2005
Filing dateMay 25, 2004
Priority dateMay 25, 2004
Publication number206002, 29206002, US D500745 S1, US D500745S1, US-S1-D500745, USD500745 S1, USD500745S1
InventorsQiang-Fei Duan, Pai-Ling Kao
Original AssigneeCooler Master Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat-dissipation fins
US D500745 S1
Abstract  available in
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  1. The ornamental design for heat-dissipation fins, as shown and described.

FIG. 1 is a perspective view of the heat-dissipation fins showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7423877 *Sep 1, 2006Sep 9, 2008Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US7532472 *Nov 28, 2006May 12, 2009Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device
US7623348Sep 28, 2007Nov 24, 2009Nidec CorporationHeat sink and cooling apparatus
US8593814 *Jul 12, 2011Nov 26, 2013Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat sink assembly
US20120188722 *Jul 12, 2011Jul 26, 2012Hon Hai Precision Industry Co., Ltd.Heat sink assembly
U.S. ClassificationD13/179