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Publication numberUSD501450 S1
Publication typeGrant
Application numberUS 29/183,270
Publication dateFeb 1, 2005
Filing dateJun 10, 2003
Priority dateJun 10, 2003
Publication number183270, 29183270, US D501450 S1, US D501450S1, US-S1-D501450, USD501450 S1, USD501450S1
InventorsMichinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
Original AssigneeSanyo Denki Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Electronic component cooling apparatus
US D501450 S1
Images(9)
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Claims(1)
  1. The ornamental design for a electronic component cooling apparatus, as shown and described.
Description

FIG. 1 is a front view of an electronic component cooling apparatus according to our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a cross-sectional view along line 88 of FIG. 5.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7331756 *Jun 29, 2004Feb 19, 2008Sanyo Denki Co., Ltd.Axial-flow fan unit and heat-emitting element cooling apparatus
US7495921 *Apr 2, 2007Feb 24, 2009Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Fan bracket and heat dissipation apparatus incorporating the same
US7742302 *Jan 16, 2008Jun 22, 2010Sanyo Denki Co., Ltd.Axial-flow fan unit and heat-emitting element cooling
US8256258Jan 15, 2008Sep 4, 2012Nidec CorporationRadiator, heat sink fan, and radiator manufacturing method
Classifications
U.S. ClassificationD13/179