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Publication numberUSD503691 S1
Publication typeGrant
Application numberUS 29/188,754
Publication dateApr 5, 2005
Filing dateAug 22, 2003
Priority dateMar 28, 2001
Publication number188754, 29188754, US D503691 S1, US D503691S1, US-S1-D503691, USD503691 S1, USD503691S1
InventorsMartin Standing, Hazel Deborah Schofield
Original AssigneeInternational Rectifier Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Conductive clip for a semiconductor package
US D503691 S1
Abstract  available in
Images(3)
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Claims(1)
  1. The ornamental design for a conductive clip for a semiconductor package, as shown and described.
Description

FIG. 1 is a perspective view of a conductive clip according to our design;

FIG. 2 is another perspective view of a conductive clip according to our design, the broken lines being included for illustrative purposes and forming no part of the claimed design;

FIG. 3 is a top plan view of a conductive clip according to our design;

FIG. 4 is a bottom plan view of a conductive clip according to our design, the broken lines being included for illustration purposes and forming no part of the claimed design;

FIG. 5 is a side elevational view of a conductive clip according to our design; and,

FIG. 6 is a side elevational view of a conductive clip according to our design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7476978May 17, 2006Jan 13, 2009Infineon Technologies, AgElectronic component having a semiconductor power device
US7541681May 4, 2006Jun 2, 2009Infineon Technologies AgInterconnection structure, electronic component and method of manufacturing the same
US7663212Mar 21, 2006Feb 16, 2010Infineon Technologies AgElectronic component having exposed surfaces
US7757392May 17, 2006Jul 20, 2010Infineon Technologies AgMethod of producing an electronic component
US7786558Oct 20, 2005Aug 31, 2010Infineon Technologies AgSemiconductor component and methods to produce a semiconductor component
US7939370Oct 29, 2009May 10, 2011Alpha And Omega Semiconductor IncorporatedPower semiconductor package
US8563360Jun 8, 2009Oct 22, 2013Alpha And Omega Semiconductor, Inc.Power semiconductor device package and fabrication method
US20070090523 *Oct 20, 2005Apr 26, 2007Ralf OtrembaSemiconductor component and methods to produce a semiconductor component
US20070215997 *Mar 17, 2006Sep 20, 2007Martin StandingChip-scale package
US20070259514 *May 4, 2006Nov 8, 2007Ralf OtrembaInterconnection Structure, Electronic Component and Method of Manufacturing the Same
US20070267729 *May 17, 2006Nov 22, 2007Ralf OtrembaElectronic Component Having a Semiconductor Power Device
US20100308454 *Jun 8, 2009Dec 9, 2010Jun LuPower semiconductor device package and fabrication method
US20110101511 *Oct 29, 2009May 5, 2011Jun LuPower semiconductor package
USD642578 *Feb 26, 2010Aug 2, 2011Sony CorporationMemory card adapter
USD658185Jul 18, 2011Apr 24, 2012Sony CorporationMemory card adapter
Classifications
U.S. ClassificationD13/182
Cooperative ClassificationH01L24/34