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Publication numberUSD505122 S1
Publication typeGrant
Application numberUS 29/173,668
Publication dateMay 17, 2005
Filing dateJan 3, 2003
Priority dateJan 3, 2003
Publication number173668, 29173668, US D505122 S1, US D505122S1, US-S1-D505122, USD505122 S1, USD505122S1
InventorsJames Harnden, Richard K. Williams, Anthony Chia, Chu Weibing, Allen K. Lam
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Portion of a matrix for surface mount package leadframe
US D505122 S1
Images(4)
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Claims(1)
  1. The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.
Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a matrix for surface mount package leadframes showing my new design.

Classifications
U.S. ClassificationD13/182