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Publication numberUSD505399 S1
Publication typeGrant
Application numberUS 29/180,822
Publication dateMay 24, 2005
Filing dateMay 1, 2003
Priority dateMar 14, 2003
Publication number180822, 29180822, US D505399 S1, US D505399S1, US-S1-D505399, USD505399 S1, USD505399S1
InventorsHiroshi Yoshida, Hisashi Kawafuji
Original AssigneeMitsubishi Denki Kabushiki Kaisha
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor device
US D505399 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for a semiconductor device, as shown and described.
Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9497570Feb 6, 2015Nov 15, 2016Nimbelink Corp.Embedded wireless modem
USD731491 *Feb 7, 2014Jun 9, 2015NimbeLink L.L.C.Embedded cellular modem
USD769834Oct 1, 2014Oct 25, 2016Mitsubishi Electric CorporationSemiconductor device
USD770994 *Jun 20, 2016Nov 8, 2016Mitsubishi Electric CorporationPower semiconductor device
USD772182 *Sep 29, 2014Nov 22, 2016Mitsubishi Electric CorporationPower semiconductor device
USD777124 *Jun 20, 2016Jan 24, 2017Mitsubishi Electric CorporationPower semiconductor device
USD783550 *Jun 20, 2016Apr 11, 2017Mitsubishi Electric CorporationPower semiconductor device
Classifications
U.S. ClassificationD13/182