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Publication numberUSD505924 S1
Publication typeGrant
Application numberUS 29/193,675
Publication dateJun 7, 2005
Filing dateNov 13, 2003
Priority dateNov 13, 2003
Publication number193675, 29193675, US D505924 S1, US D505924S1, US-S1-D505924, USD505924 S1, USD505924S1
InventorsHiroyuki Okuyama, Masato Doi, Goshi Biwa, Toyoharu Oohata
Original AssigneeSony Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor element
US D505924 S1
Abstract  available in
Images(25)
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Claims(1)
  1. The ornamental design for a semiconductor element, as shown and described.
Description

FIG. 1 is a perspective view of a first embodiment of a semiconductor element showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof; and

FIG. 6 is a top plan view thereof.

FIG. 7 is a perspective view of a second embodiment of a semiconductor element showing our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a left side elevational view thereof;

FIG. 11 is a right side elevational view thereof; and

FIG. 12 is a top plan view thereof.

FIG. 13 is a perspective view of a third embodiment of a semiconductor element showing our new design;

FIG. 14 is a front elevational view thereof;

FIG. 15 is a rear elevational view thereof;

FIG. 16 is a left side elevational view thereof;

FIG. 17 is a right side elevational view thereof; and

FIG. 18 is a top plan view thereof.

FIG. 19 is a perspective view of a fourth embodiment of a semiconductor element showing our new design;

FIG. 20 is a front elevational view thereof;

FIG. 21 is a rear elevational view thereof;

FIG. 22 is a left side elevational view thereof;

FIG. 23 is a right side elevational view thereof; and

FIG. 24 is a top plan view thereof.

Lower part of the semiconductor element is opaque or transparent.

FIG. 25 is a perspective view of a fifth embodiment of a semiconductor element showing our new design;

FIG. 26 is a front elevational view thereof;

FIG. 27 is a rear elevational view thereof;

FIG. 28 is a left side elevational view thereof;

FIG. 29 is a right side elevational view thereof; and

FIG. 30 is a top plan view thereof.

Lower part of the semiconductor element is opaque or transparent.

FIG. 31 is a perspective view of a sixth embodiment of a semiconductor element showing our new design;

FIG. 32 is a front elevational view thereof;

FIG. 33 is a rear elevational view thereof;

FIG. 34 is a left side elevational view thereof;

FIG. 35 is a right side elevational view thereof; and,

FIG. 36 is a top plan view thereof.

Lower part of the semiconductor element is opaque or transparent.

The broken lines shown in the Figures are for illustrative purposes only and form no part of the claimed design. A bottom plan view in the first, second, third, fourth, fifth, and sixth embodiments is not part of the claimed design.

Classifications
U.S. ClassificationD13/182