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Publication numberUSD508897 S1
Publication typeGrant
Application numberUS 29/212,683
Publication dateAug 30, 2005
Filing dateSep 3, 2004
Priority dateSep 3, 2004
Publication number212683, 29212683, US D508897 S1, US D508897S1, US-S1-D508897, USD508897 S1, USD508897S1
InventorsMichael Phipps, Timothy J. Southgate
Original AssigneeAltera Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Embedded circuit board
US D508897 S1
Abstract  available in
Images(8)
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Claims(1)
  1. We claim the ornamental design for an embedded circuit board, as shown and described.
Description

FIG. 1 is a perspective view of a embedded circuit board in accordance with the design;

FIG. 2 is a front view of the embedded circuit board of FIG. 1;

FIG. 3 is a back view of the embedded circuit board of FIG. 1;

FIG. 4 is a left view of the embedded circuit board of FIG. 1;

FIG. 5 is a right view of the embedded circuit board of FIG. 1;

FIG. 6 is a top view of the embedded circuit board of FIG. 1; and,

FIG. 7 is a bottom view of the embedded circuit board of FIG. 1.

The dash-dot broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design. The dot-dot broken lines define the bounds of the claimed design and form no part thereof.

The present design is related to an article of manufacture in the form of an embedded circuit board.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7336500 *Sep 3, 2004Feb 26, 2008Altera CorporationMethod and apparatus for encapsulating a printed circuit board
Classifications
U.S. ClassificationD13/184