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Publication numberUSD509195 S1
Publication typeGrant
Application numberUS 29/179,243
Publication dateSep 6, 2005
Filing dateApr 8, 2003
Priority dateApr 8, 2003
Publication number179243, 29179243, US D509195 S1, US D509195S1, US-S1-D509195, USD509195 S1, USD509195S1
InventorsBily Wang, Jonnie Chuang, Yann Lee
Original AssigneeHarvatek Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Light emitting diode package
US D509195 S1
Abstract  available in
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  1. The ornamental design for a light emitting diode package, as shown and described.

A light emitting diode (LED) with two top electrodes is mounted on a first metal plate. One of the electrodes is wire-bonded to the first metal plate serving as one terminal of the LED. The other electrode of the LED is connected by wire-bonding to a second metal plate serving as a second terminal of the LED. The inner ends of the metal plates and the LED are imbedded in a transparent glue, leaving the outer ends of the metal plates for external connection. The transparent glue allows the light emitted from the LED to be radiated.

FIG. 1 is a top plan view of the light emitting diode package showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof; and,

FIG. 5 is a side elevation view thereof.

U.S. ClassificationD13/180