Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD509806 S1
Publication typeGrant
Application numberUS 29/209,512
Publication dateSep 20, 2005
Filing dateJul 16, 2004
Priority dateJul 16, 2004
Publication number209512, 29209512, US D509806 S1, US D509806S1, US-S1-D509806, USD509806 S1, USD509806S1
InventorsHsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen
Original AssigneeHon Hai Precision Industry Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation device
US D509806 S1
Images(7)
Previous page
Next page
Claims(1)
  1. The ornamental design for a heat dissipation device, as shown and described.
Description

FIG. 1 is a perspective view of a heat dissipation device of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view thereof being mounted to a VGA card which is shown in broken lines for illustrative purposes only and forms no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7304846 *Feb 11, 2005Dec 4, 2007Inventec CorporationHeatsink device of video graphics array and chipset
US8035964 *Jan 13, 2009Oct 11, 2011Intelligent Electronic SystemsMulti-position housing made of metal extruded section member for manufacturing a waterproof power electronic device
Classifications
U.S. ClassificationD13/179