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Publication numberUSD509806 S1
Publication typeGrant
Application numberUS 29/209,512
Publication dateSep 20, 2005
Filing dateJul 16, 2004
Priority dateJul 16, 2004
Publication number209512, 29209512, US D509806 S1, US D509806S1, US-S1-D509806, USD509806 S1, USD509806S1
InventorsHsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen
Original AssigneeHon Hai Precision Industry Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation device
US D509806 S1
Abstract  available in
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  1. The ornamental design for a heat dissipation device, as shown and described.

FIG. 1 is a perspective view of a heat dissipation device of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view thereof being mounted to a VGA card which is shown in broken lines for illustrative purposes only and forms no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7304846 *Feb 11, 2005Dec 4, 2007Inventec CorporationHeatsink device of video graphics array and chipset
US8035964 *Jan 13, 2009Oct 11, 2011Intelligent Electronic SystemsMulti-position housing made of metal extruded section member for manufacturing a waterproof power electronic device
U.S. ClassificationD13/179