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Publication numberUSD509810 S1
Publication typeGrant
Application numberUS 29/187,214
Publication dateSep 20, 2005
Filing dateJul 30, 2003
Priority dateJul 30, 2003
Publication number187214, 29187214, US D509810 S1, US D509810S1, US-S1-D509810, USD509810 S1, USD509810S1
InventorsHan-Cheng Hsu
Original AssigneeDelta Electronics Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Molding structure of electric element
US D509810 S1
Abstract  available in
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  1. The ornamental design for a molding structure of electric element, as shown and described herein.

FIG. 1 is a perspective view of a molding structure of electric element;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a top plane view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plane view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a rear elevational view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD796459 *Sep 28, 2016Sep 5, 2017Rohm Co., Ltd.Packaged semiconductor circuit module
U.S. ClassificationD13/182