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Publication numberUSD510728 S1
Publication typeGrant
Application numberUS 29/211,047
Publication dateOct 18, 2005
Filing dateAug 11, 2004
Priority dateAug 11, 2004
Publication number211047, 29211047, US D510728 S1, US D510728S1, US-S1-D510728, USD510728 S1, USD510728S1
InventorsPhillip Celaya, Darrell D. Truhitte, Michael J. Seddon
Original AssigneeSemiconductor Components Industries Llc
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor device package
US D510728 S1
Abstract  available in
Images(4)
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Claims(1)
  1. We claim the ornamental design for a semiconductor device package, as shown and described.
Description

FIG. 1 is a perspective view from the front left side and below the semiconductor device package showing our new design.

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is an elevational view from the front side thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD731491 *Feb 7, 2014Jun 9, 2015NimbeLink L.L.C.Embedded cellular modem
USD732487 *Jan 21, 2014Jun 23, 2015Formosa Epitaxy IncorporationPartial semiconductor light emitting component
USD732488 *Jan 21, 2014Jun 23, 2015Formosa Epitaxy IncorporationPartial semiconductor light emitting component
Classifications
U.S. ClassificationD13/182