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Publication numberUSD510915 S1
Publication typeGrant
Application numberUS 29/191,603
Publication dateOct 25, 2005
Filing dateOct 10, 2003
Priority dateJul 9, 2003
Publication number191603, 29191603, US D510915 S1, US D510915S1, US-S1-D510915, USD510915 S1, USD510915S1
InventorsShogo Horinouchi, Hideki Ohyama
Original AssigneeMatsushita Electric Industrial Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Optoelectronic IC package
US D510915 S1
Abstract  available in
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  1. The ornamental design for an optoelectronic IC package, as shown and described.

FIG. 1 is a top perspective view of an optoelectronic IC package of the present invention;

FIG. 2 is a first side view thereof;

FIG. 3 is a second side view thereof;

FIG. 4 is a third side view thereof;

FIG. 5 is a top view thereof; and,

FIG. 6 is a fourth side view thereof.

The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

U.S. ClassificationD13/182