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Publication numberUSD511326 S1
Publication typeGrant
Application numberUS 29/196,215
Publication dateNov 8, 2005
Filing dateDec 23, 2003
Priority dateJun 25, 2003
Publication number196215, 29196215, US D511326 S1, US D511326S1, US-S1-D511326, USD511326 S1, USD511326S1
InventorsMichinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
Original AssigneeSanyo Denki Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Electronic component cooling apparatus
US D511326 S1
Abstract  available in
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  1. The ornamental design for an electronic component cooling apparatus, as shown and described.

FIG. 1 is a front side elevation view.

FIG. 2 is a rear side elevation view.

FIG. 3 is a right side elevation view.

FIG. 4 is a left side elevation view.

FIG. 5 is a top plan view.

FIG. 6 is a bottom plan view; and,

FIG. 7 is a perspective view.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7152666 *Aug 18, 2004Dec 26, 2006Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat sink
US7532472 *Nov 28, 2006May 12, 2009Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device
US8256258Jan 15, 2008Sep 4, 2012Nidec CorporationRadiator, heat sink fan, and radiator manufacturing method
US8665595 *May 16, 2006Mar 4, 2014Ol Security Limited Liability CompanyMethod and apparatus for cooling a circuit component
U.S. ClassificationD13/179