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Publication numberUSD511331 S1
Publication typeGrant
Application numberUS 29/191,635
Publication dateNov 8, 2005
Filing dateOct 10, 2003
Priority dateJul 9, 2003
Publication number191635, 29191635, US D511331 S1, US D511331S1, US-S1-D511331, USD511331 S1, USD511331S1
InventorsShogo Horinouchi, Hideki Ohyama
Original AssigneeMatsushita Electric Industrial Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Optoelectronic IC package
US D511331 S1
Images(3)
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Claims(1)
  1. We claim the ornamental design for an optoelectronic IC package, as shown and described.
Description

FIG. 1 is a top perspective view of an optoelectronic IC package of the present invention;

FIG. 2 is a first side view thereof;

FIG. 3 is a second side view thereof;

FIG. 4 is a third side view thereof;

FIG. 5 is a top view thereof; and,

FIG. 6 is a fourth side view thereof.

The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8089075 *Apr 17, 2009Jan 3, 2012Avago Technologies Ecbu Ip (Singapore) Pte. Ltd.LFCC package with a reflector cup surrounded by a single encapsulant
US8101955 *Apr 17, 2009Jan 24, 2012Avago Technologies Ecbu Ip (Singapore) Pte. Ltd.PLCC package with a reflector cup surrounded by an encapsulant
Classifications
U.S. ClassificationD13/182