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Publication numberUSD513608 S1
Publication typeGrant
Application numberUS 29/173,644
Publication dateJan 17, 2006
Filing dateJan 3, 2003
Priority dateJan 3, 2003
Publication number173644, 29173644, US D513608 S1, US D513608S1, US-S1-D513608, USD513608 S1, USD513608S1
InventorsJames Harnden, Richard K. Williams, Anthony Chia, Chu Weibing, Allen K. Lam
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Portion of a matrix for surface mount package leadframe
US D513608 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.
Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20130175679 *Mar 4, 2013Jul 11, 2013Cheng-Hong SuOptoisolator leadframe assembly
Classifications
U.S. ClassificationD13/182