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Publication numberUSD513976 S1
Publication typeGrant
Application numberUS 29/189,066
Publication dateJan 31, 2006
Filing dateAug 28, 2003
Priority dateAug 28, 2003
Publication number189066, 29189066, US D513976 S1, US D513976S1, US-S1-D513976, USD513976 S1, USD513976S1
InventorsHenry Milan
Original AssigneeHenry Milan
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Package for computer cable
US D513976 S1
Abstract  available in
Images(5)
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Claims(1)
  1. The ornamental design for a package for computer cable, as shown and described.
Description

FIG. 1 is a perspective view disclosing an embodiment of a blister package for a computer cable incorporating my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 if a right side elevational view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a top plan view of an alternate embodiment of my design as illustrated in FIGS. 1-6.

The broken line showing in the views is for illustrative purposes only and forms no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8899419Mar 28, 2012Dec 2, 2014Aventisub Ii Inc.Package with break-away clamshell
US8919559Aug 6, 2012Dec 30, 2014Aventisub Ii Inc.Package with break-away clamshell
USD687313Mar 28, 2012Aug 6, 2013Aventisub Ii Inc.A-shaped blister card
USD693695Mar 28, 2012Nov 19, 2013Aventisub Ii Inc.Package for product
USD694644Mar 28, 2012Dec 3, 2013Aventisub Ii Inc.Clamshell package having blisters
USD695625Aug 6, 2012Dec 17, 2013Aventisub Ii Inc.Package for product
USD697813Aug 6, 2012Jan 21, 2014Aventisub Ii Inc.Clamshell having blisters received therein
Classifications
U.S. ClassificationD09/415, D09/418