US D513976 S1
Abstract available in
FIG. 1 is a perspective view disclosing an embodiment of a blister package for a computer cable incorporating my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 if a right side elevational view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a top plan view of an alternate embodiment of my design as illustrated in FIGS. 1-6.
The broken line showing in the views is for illustrative purposes only and forms no part of the claimed design.