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Publication numberUSD514075 S1
Publication typeGrant
Application numberUS 29/195,849
Publication dateJan 31, 2006
Filing dateDec 18, 2003
Priority dateDec 18, 2003
Publication number195849, 29195849, US D514075 S1, US D514075S1, US-S1-D514075, USD514075 S1, USD514075S1
InventorsAmand J. Hahn, Rod P. Boer, Eric A. Schneider
Original AssigneeHoneywell International Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Housing for an electronic circuit module
US D514075 S1
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  1. The ornamental design for a housing for an electronic circuit module, as shown and described.

The housing for an electronic circuit module is intended to be used to house electronic circuit board and their included electronic components and other electronic circuitry.

FIG. 1 is a right side perspective view of the housing for an electronic circuit module embodying our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken line disclosures in the drawings are for illustrative purposes only and form no part of the claimed design.

U.S. ClassificationD13/184