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Publication numberUSD519470 S1
Publication typeGrant
Application numberUS 29/233,206
Publication dateApr 25, 2006
Filing dateJun 28, 2005
Priority dateDec 18, 2003
Also published asUSD516047, USD518450, USD518452, USD519087
Publication number233206, 29233206, US D519470 S1, US D519470S1, US-S1-D519470, USD519470 S1, USD519470S1
InventorsAmand J. Hahn, Rod P. Boer, Eric A. Schneider
Original AssigneeHoneywell International Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Modular electronic housing and assemblies
US D519470 S1
Abstract  available in
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  1. The ornamental design for a modular electronic housing and assemblies, as shown and described.

The modular electronic housing and assemblies comprises a modular electronic housing intended to be used to house electronic circuit boards and their included electronic components.

The FIGURE is a right side perspective view of a modular electronic housing and assemblies showing our new design.

The broken line disclosure in the drawings are for illustrative purposes only and form no part of the claimed design.

U.S. ClassificationD13/184