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Publication numberUSD522470 S1
Publication typeGrant
Application numberUS 29/217,557
Publication dateJun 6, 2006
Filing dateNov 19, 2004
Priority dateSep 9, 2004
Publication number217557, 29217557, US D522470 S1, US D522470S1, US-S1-D522470, USD522470 S1, USD522470S1
InventorsYukiko Mizukoshi
Original AssigneeKabushiki Kaisha Toshiba
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Portion of a semiconductor device
US D522470 S1
Abstract  available in
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  1. The ornamental design for portion of a semiconductor device, as shown and described.

FIG. 1 is a top plan view of portion of a semiconductor device, showing my new design; the opposite side being a mirror image thereof;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof; the opposite side being a mirror image thereof;

FIG. 4 is a rear elevational view thereof; and,

FIG. 5 is an enlarged fragmented rear elevational view thereof, taken along the line 5—5 in FIG. 2.

The broken lines are for illustrative purposes only and form no part of the claimed design.

U.S. ClassificationD13/182