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Publication numberUSD525213 S1
Publication typeGrant
Application numberUS 29/180,813
Publication dateJul 18, 2006
Filing dateMay 1, 2003
Priority dateNov 1, 2002
Publication number180813, 29180813, US D525213 S1, US D525213S1, US-S1-D525213, USD525213 S1, USD525213S1
InventorsJanos-Gerold Enderlein, Jörg Romahn
Original AssigneeSiemens Aktiengesellschaft
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Circuit board
US D525213 S1
Abstract  available in
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  1. The ornamental design for a circuit board, as shown and described.

FIG. 1 is a front perspective of the invention.

FIG. 2 is a plan elevation of the invention.

FIG. 3 is a bottom plan of the invention.

FIG. 4 is a front elevation of the invention.

FIG. 5 is a rear elevation of the invention.

FIG. 6 is a right end elevation of the invention; and,

FIG. 7 is a left end elevation of the invention.

The broken lines define the boundary of the claimed design and form no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD769833Aug 29, 2014Oct 25, 2016Apple Inc.Component for electronic device
USD776801 *Dec 24, 2014Jan 17, 2017Kobe Steel, LtdHeat exchanger tube
U.S. ClassificationD13/182