US D529450 S1
This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.
FIG. 1 is a front side elevation view of the heat sink;
FIG. 2 is a rear side elevation view;
FIG. 3 is a right side elevation view;
FIG. 4 is a left side elevation view;
FIG. 5 is a top plan view;
FIG. 6 is a bottom plan view;
FIG. 7 is a perspective view as viewed from the front;
FIG. 8 is a perspective view as viewed from the rear;
FIG. 9 is a cross sectional view as taken along line 9—9 of FIG. 1; and,
FIG. 10 is a cross sectional view as taken along line 10—10 of FIG. 5.
This article is formed with a plurality of metallic fins which are integrally provided on a metallic base.