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Publication numberUSD541285 S1
Publication typeGrant
Application numberUS 29/235,642
Publication dateApr 24, 2007
Filing dateAug 3, 2005
Priority dateAug 3, 2005
Publication number235642, 29235642, US D541285 S1, US D541285S1, US-S1-D541285, USD541285 S1, USD541285S1
InventorsQiang Wang, Minh H. Nguyen, David A. Selvidge
Original AssigneeHewlett-Packard Development Company, L.P.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Computer processor module having a front release mechanism
US D541285 S1
Abstract  available in
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Claims(1)
  1. The ornamental design for a computer processor module having a front release mechanism, as shown and described.
Description

FIG. 1 is an enlarged partial front perspective view of the design for the computer processor module having a front release mechanism in a secured configuration;

FIG. 2 is a front elevational view of the design for the computer processor module having a front release mechanism in a secured configuration as illustrated in FIG. 1;

FIG. 3 is a right side elevational view of the design for the computer processor module having a front release mechanism in a secured configuration as illustrated in FIG. 1, the left side being substantially the same as the illustrated right side;

FIG. 4 is a top elevational view of the design for the computer processor module having a front release mechanism in a secured configuration as illustrated in FIG. 1;

FIG. 5 is a bottom elevational view of the design for the computer processor module having a front release mechanism in a secured configuration as illustrated in FIG. 1;

FIG. 6 is a partial front perspective view of the design for the computer processor module having a front release mechanism as illustrated in FIG. 1, wherein the front release mechanism is illustrated in a partially release configuration;

FIG. 7 is a partial front perspective view of the design for the computer processor module having a front release mechanism as illustrated in FIG. 1, wherein the front release mechanism is illustrated in a fully released configuration;

FIG. 8 is a front elevational view of the design for the computer processor module having a front release mechanism in a fully released configuration as illustrated in FIG. 7;

FIG. 9 is a right side elevational view of the design for the computer processor module having a front release mechanism in a fully released configuration as illustrated in FIG. 7, the left side being substantially the same as the illustrated right side;

FIG. 10 is a top elevational view of the design for the computer processor module having a front release mechanism in a fully released configuration as illustrated in FIG. 7;

FIG. 11 is a bottom elevational view of the design for the computer processor module having a front release mechanism in a fully released configuration as illustrated in FIG. 7;

FIG. 12 is a partial front perspective view of the design for the computer processor module having a front release mechanism as illustrated in FIG. 1, wherein the computer processor module is illustrated in context of a rack mountable computer, e.g., a server, that can be mounted in a rack computer system; and,

FIG. 13 is a front elevational view of the design for the computer processor module having a front release mechanism as illustrated in FIG. 12, wherein the computer processor module is illustrated in context of a rack mountable computer, e.g., a server, that can be mounted in a rack computer system.

In these drawings, the solid lines illustrate the claimed ornamental design, whereas the broken lines illustrate environmental features that form no part of the claimed ornamental design of the subject embodiment.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7558075 *Mar 27, 2006Jul 7, 2009Hewlett-Packard Development Company, L.P.Accessing an interior of an electronic system
Classifications
U.S. ClassificationD14/445