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Publication numberUSD541757 S1
Publication typeGrant
Application numberUS 29/245,086
Publication dateMay 1, 2007
Filing dateDec 19, 2005
Priority dateDec 19, 2005
Publication number245086, 29245086, US D541757 S1, US D541757S1, US-S1-D541757, USD541757 S1, USD541757S1
InventorsSang Cheol Lee, Sun Gyu Yoon, Sang Jun Jung, Kook Young Yoon
Original AssigneeZalman Tech Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Radiator for electronic parts
US D541757 S1
Abstract  available in
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  1. The ornamental design for a radiator for electronic parts, as shown and described.

FIG. 1 is a perspective view of a a radiator for electronic parts in accordance with the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7942194Aug 7, 2007May 17, 2011Fujikura Ltd.Heat sink
US20080202729 *Aug 19, 2007Aug 28, 2008Fujikura Ltd.Heat sink
US20080251239 *Aug 7, 2007Oct 16, 2008Fujikura Ltd.Heat sink
US20080310105 *Jun 14, 2007Dec 18, 2008Chia-Chun ChengHeat dissipating apparatus and water cooling system having the same
US20100051231 *Jun 11, 2009Mar 4, 2010Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation apparatus having a heat pipe inserted therein
US20100230074 *Jun 15, 2009Sep 16, 2010Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd.Heat dissipation apparatus
U.S. ClassificationD13/179