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Publication numberUSD544452 S1
Publication typeGrant
Application numberUS 29/255,496
Publication dateJun 12, 2007
Filing dateMar 8, 2006
Priority dateSep 8, 2005
Publication number255496, 29255496, US D544452 S1, US D544452S1, US-S1-D544452, USD544452 S1, USD544452S1
InventorsAkihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao
Original AssigneeTokyo Ohka Kogyo Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Supporting plate
US D544452 S1
Abstract  available in
Images(5)
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Claims(1)
  1. The ornamental design for a supporting plate, as shown.
Description

FIG. 1 is a top plan view of our new, original and ornamental design for a supporting plate;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side elevational view thereof; and,

FIG. 5 is a left side elevational view thereof.

A rear elevational view of is the same as the front elevational view of FIG. 2.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8308931Nov 7, 2008Nov 13, 2012Novellus Systems, Inc.Method and apparatus for electroplating
US8475636Jun 9, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8475644Oct 26, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9309604May 31, 2013Apr 12, 2016Novellus Systems, Inc.Method and apparatus for electroplating
US9394620Jun 18, 2014Jul 19, 2016Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9449808May 29, 2013Sep 20, 2016Novellus Systems, Inc.Apparatus for advanced packaging applications
US9464361Jun 19, 2014Oct 11, 2016Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9523155Dec 11, 2013Dec 20, 2016Novellus Systems, Inc.Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592May 13, 2013Apr 18, 2017Novellus Systems, Inc.Cross flow manifold for electroplating apparatus
US9670588Apr 11, 2014Jun 6, 2017Lam Research CorporationAnisotropic high resistance ionic current source (AHRICS)
US20100032310 *Nov 7, 2008Feb 11, 2010Novellus Systems, Inc.Method and apparatus for electroplating
US20100044236 *Oct 26, 2009Feb 25, 2010Novellus Systems, Inc.Method and apparatus for electroplating
US20100116672 *Jun 9, 2009May 13, 2010Novellus Systems, Inc.Method and apparatus for electroplating
USD748593 *Mar 5, 2014Feb 2, 2016Hzo, Inc.Boat for use in a material deposition apparatus
USD760180 *Feb 21, 2014Jun 28, 2016Hzo, Inc.Hexcell channel arrangement for use in a boat for a deposition apparatus
USD778247 *Apr 16, 2015Feb 7, 2017Veeco Instruments Inc.Wafer carrier with a multi-pocket configuration
USD784937Apr 24, 2015Apr 25, 2017Tokyo Electron LimitedDummy wafer
USD785576 *Apr 24, 2015May 2, 2017Tokyo Electron LimitedDummy wafer
USD786810Apr 24, 2015May 16, 2017Tokyo Electron LimitedDummy wafer
USD793971Mar 27, 2015Aug 8, 2017Veeco Instruments Inc.Wafer carrier with a 14-pocket configuration
USD793972Mar 27, 2015Aug 8, 2017Veeco Instruments Inc.Wafer carrier with a 31-pocket configuration
Classifications
U.S. ClassificationD13/182