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Publication numberUSD544452 S1
Publication typeGrant
Application numberUS 29/255,496
Publication dateJun 12, 2007
Filing dateMar 8, 2006
Priority dateSep 8, 2005
Publication number255496, 29255496, US D544452 S1, US D544452S1, US-S1-D544452, USD544452 S1, USD544452S1
InventorsAkihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao
Original AssigneeTokyo Ohka Kogyo Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Supporting plate
US D544452 S1
Abstract  available in
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  1. The ornamental design for a supporting plate, as shown.

FIG. 1 is a top plan view of our new, original and ornamental design for a supporting plate;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side elevational view thereof; and,

FIG. 5 is a left side elevational view thereof.

A rear elevational view of is the same as the front elevational view of FIG. 2.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8308931Nov 7, 2008Nov 13, 2012Novellus Systems, Inc.Method and apparatus for electroplating
US8475636Jun 9, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8475644Oct 26, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
U.S. ClassificationD13/182