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Publication numberUSD548203 S1
Publication typeGrant
Application numberUS 29/264,892
Publication dateAug 7, 2007
Filing dateAug 22, 2006
Priority dateApr 17, 2006
Publication number264892, 29264892, US D548203 S1, US D548203S1, US-S1-D548203, USD548203 S1, USD548203S1
InventorsIchiro Takahashi
Original AssigneeKabushiki Kaisha Toshiba
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
US D548203 S1
Abstract  available in
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  1. The ornamental design for a semiconductor, as shown and described.

FIG. 1 is a bottom, front and left side perspective view of a semiconductor showing my new design,

FIG. 2 is a front elevational view thereof,

FIG. 3 is a rear elevational view thereof,

FIG. 4 is a right side elevational view thereof,

FIG. 5 is a right side elevational view thereof,

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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USD731491 *Feb 7, 2014Jun 9, 2015NimbeLink L.L.C.Embedded cellular modem
USD748595 *Feb 3, 2015Feb 2, 2016Infineon Technologies AgPower semiconductor module
U.S. ClassificationD13/182