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Publication numberUSD548705 S1
Publication typeGrant
Application numberUS 29/245,047
Publication dateAug 14, 2007
Filing dateDec 19, 2005
Priority dateSep 29, 2005
Publication number245047, 29245047, US D548705 S1, US D548705S1, US-S1-D548705, USD548705 S1, USD548705S1
InventorsDaisuke Hayashi
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Attracting disc for an electrostatic chuck for semiconductor production
US D548705 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for an attracting disc for an electrostatic chuck for semiconductor production, as shown and described.
Description

FIG. 1 is a front elevational view of an attracting disc for an electrostatic chuck for semiconductor production, showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8308931Nov 7, 2008Nov 13, 2012Novellus Systems, Inc.Method and apparatus for electroplating
US8475636Jun 9, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8475644Oct 26, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
Classifications
U.S. ClassificationD13/182