Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD552047 S1
Publication typeGrant
Application numberUS 29/236,992
Publication dateOct 2, 2007
Filing dateAug 25, 2005
Priority dateFeb 28, 2005
Publication number236992, 29236992, US D552047 S1, US D552047S1, US-S1-D552047, USD552047 S1, USD552047S1
InventorsKazuyuki Sugawara
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Process tube for manufacturing semiconductor wafers
US D552047 S1
Abstract  available in
Previous page
Next page
  1. The ornamental design for a process tube for manufacturing semiconductor wafers, as shown and described.

FIG. 1 is a reference perspective view of the process tube for manufacturing semiconductor wafers;

FIG. 2 is a reference perspective view of the process tube as seen from another direction;

FIG. 3 is a front view of the process tube;

FIG. 4 is a back view thereof;

FIG. 5 is a left side view thereof. A right side view thereof is a mirror image thereto;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a sectional view taken along line 88 in FIG. 6; and,

FIG. 9 is a sectional view taken along line 99 in FIG. 3.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9163311 *Dec 21, 2011Oct 20, 2015Tokyo Electron LimitedFilm forming apparatus
US20110278164 *Nov 17, 2011Hon Hai Precision Industry Co., Ltd.Sputtering device
US20120180727 *Dec 21, 2011Jul 19, 2012Tokyo Electron LimitedFilm forming apparatus
U.S. ClassificationD13/182