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Publication numberUSD552138 S1
Publication typeGrant
Application numberUS 29/245,738
Publication dateOct 2, 2007
Filing dateDec 29, 2005
Priority dateJun 29, 2005
Publication number245738, 29245738, US D552138 S1, US D552138S1, US-S1-D552138, USD552138 S1, USD552138S1
InventorsMasaki Kondo, Tomohiro Abe
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Arm transferring substrate to be processed
US D552138 S1
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  1. The ornamental design for an arm transferring substrate to be processed, as shown and described.

FIG. 1 is a front elevational view of an arm transferring substrate to be processed, showing our new design;

FIG. 2 bottom plan view thereof;

FIG. 3 is right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom and right front perspective view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8376428 *Jul 25, 2007Feb 19, 2013Dynamic Micro System Semiconductor Equipment GmbHIntegrated gripper for workpiece transfer
US8651539Jan 13, 2013Feb 18, 2014Dynamic Micro SystemIntegrated gripper for workpiece transfer
US20080131239 *Jul 25, 2007Jun 5, 2008Dynamic Micro SystemsIntegrated gripper for workpiece transfer
USRE43781 *Dec 22, 2011Nov 6, 2012Ulvac, Inc.Vacuum transfer robot
USRE44567 *Dec 22, 2011Nov 5, 2013Ulvac, Inc.Vacuum transfer robot
U.S. ClassificationD15/199