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Publication numberUSD552165 S1
Publication typeGrant
Application numberUS 29/205,875
Publication dateOct 2, 2007
Filing dateMay 24, 2004
Priority dateDec 9, 2003
Publication number205875, 29205875, US D552165 S1, US D552165S1, US-S1-D552165, USD552165 S1, USD552165S1
InventorsMasuo Sogabe
Original AssigneeDaisey Machinery Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Line thermal head letter printing apparatus
US D552165 S1
Images(8)
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Claims(1)
  1. The ornamental design for a line thermal head letter printing apparatus, as shown and described.
Description

FIG. 1 is a front view of a line thermal head letter printing apparatus of the present invention;

FIG. 2 is a rear view of the design;

FIG. 3 is a left side view of the design;

FIG. 4 is a perspective view of the design;

FIG. 5 is a top view of the design;

FIG. 6 is a bottom view of the design; and,

FIG. 7 is a right side view of the design.

Classifications
U.S. ClassificationD18/50