Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD553104 S1
Publication typeGrant
Application numberUS 29/215,644
Publication dateOct 16, 2007
Filing dateOct 19, 2004
Priority dateApr 21, 2004
Publication number215644, 29215644, US D553104 S1, US D553104S1, US-S1-D553104, USD553104 S1, USD553104S1
InventorsKaoru Oohashi, Shunsuke Mizukami, Takehiro Ueda
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Absorption board for an electric chuck used in semiconductor manufacture
US D553104 S1
Abstract  available in
Images(5)
Previous page
Next page
Claims(1)
  1. We claim the ornamental design for an absorption board for an electric chuck used in semiconductor manufacture, as shown.
Description

FIG. 1 is a perspective view of an absorption board for an electric chuck used in semiconductor manufacture.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a right side elevational view thereof, the left side elevational view being a mirror image and not shown; and,

FIG. 5 is a top plan view thereof, the bottom plan view being a mirror image and not shown.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8308931Nov 7, 2008Nov 13, 2012Novellus Systems, Inc.Method and apparatus for electroplating
US8475636Jun 9, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9117866Jul 31, 2012Aug 25, 2015Asm Ip Holding B.V.Apparatus and method for calculating a wafer position in a processing chamber under process conditions
US9167625Nov 14, 2012Oct 20, 2015Asm Ip Holding B.V.Radiation shielding for a substrate holder
US9169975Aug 28, 2012Oct 27, 2015Asm Ip Holding B.V.Systems and methods for mass flow controller verification
US9177784Feb 18, 2014Nov 3, 2015Asm Ip Holdings B.V.Semiconductor device dielectric interface layer
US9202727Mar 2, 2012Dec 1, 2015ASM IP HoldingSusceptor heater shim
US9228259Jan 28, 2014Jan 5, 2016Asm Ip Holding B.V.Method for treatment of deposition reactor
US9240412Sep 27, 2013Jan 19, 2016Asm Ip Holding B.V.Semiconductor structure and device and methods of forming same using selective epitaxial process
USD734377 *Sep 27, 2013Jul 14, 2015Hirata CorporationTop cover of a load lock chamber
USD743357 *Mar 1, 2013Nov 17, 2015Asm Ip Holding B.V.Susceptor
Classifications
U.S. ClassificationD13/182