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Publication numberUSD553932 S1
Publication typeGrant
Application numberUS 29/236,666
Publication dateOct 30, 2007
Filing dateAug 19, 2005
Priority dateAug 19, 2005
Fee statusPaid
Publication number236666, 29236666, US D553932 S1, US D553932S1, US-S1-D553932, USD553932 S1, USD553932S1
InventorsLewyn B. Boler, Jr.
Original AssigneeBoler Jr Lewyn B
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Buffing pad
US D553932 S1
Abstract  available in
Images(3)
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Claims(1)
  1. The ornamental design for a buffing pad, as shown and described.
Description

FIG. 1 is a perspective view of a buffing pad according to the invention.

FIG. 2 is a top view of the buffing pad shown in FIG. 1; and,

FIG. 3 is side view of the buffing pad shown in FIG. 1.

The bottom of the buffing pad is not shown because it forms no part of the claimed design. The broken line showing at the center of the buffing pad in the FIGS. 1 and 2 views is for illustrative purposes only and forms no part of the claimed design.

Classifications
U.S. ClassificationD08/70
Legal Events
DateCodeEventDescription
Nov 28, 2014REMIMaintenance fee reminder mailed
Jun 22, 2010FPAYFee payment
Year of fee payment: 4
Sep 28, 2005ASAssignment
Owner name: HANDYWAY CO., LTD., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HSAI, CHIN-HUI;REEL/FRAME:017041/0963
Effective date: 20050919